Scholarship for Japan Students at Bond University on 30th Anniversary in Australia, 2019 is open for Selected Countries . The scholarship allows Masters level program(s) in the field of taught at Bond University . The deadline of the scholarship is .
Scholarship Description: Bond University is pleased to invite to Japanese applicants for 30th Anniversary Scholarship – Japan. This scholarship is available to Japanese students commencing either a bachelor or masters degree at Bond University in 2019 or 2020.
The programme is offering a number of part-fee scholarships to high achieving students from Japan, to commemorate the historic milestone in Japanese-Australian friendship.
Scholarship Provider: Bond University aims to help identify future leaders and realize their full potential by providing access to an exceptional educational experience. It is Australia’s first private, not-for-profit university, offering a personalised academic environment that enables graduates to exceed the outer limits of their potential.
Degree Level: Scholarships are available for the bachelor or masters degree programs
Scholarship Benefits: 50% tuition fee remission
Eligible Countries: Japan
Available Subjects: Undergraduate, Postgraduate courses are eligible for this scholarship
Eligibility Criteria: To be considered, applicants must:
Application Procedure:
Students must complete the Bond University Online Application Form to receive their program offer before applying for this scholarship.
Scholarships Benefits:
Deadline: 24 May 2019
Scholarship for Japan Students at Bond University on 30th Anniversary in Australia, 2019 is available to undertake Masters level programs at Bond University.
Following subject are available to study under this scholarship program.
Achievement Scholarships for International Undergraduate Students: Engineering and Information Technology, University of Technology Sydney